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Abbreviation for Transmitter Optical Subassembly. Here's a brief introduction to the relevant knowledge:
The optical transmission module is divided into a single-mode optical transmission module and a multi-mode optical transmission module. The overall product architecture includes two major parts: an optical subassembly (OSA) and an electrical subassembly (ESA). Firstly, the epitaxial portion is made of gallium arsenide (GaAs), indium phosphide (InP), indium gallium arsenide (InGaAs), etc., as a light emitting and light detecting material, and a metal-organic chemical vapor deposition (MOCVD) method is used. ) Etc. Ways to make an epitaxial wafer. In the chip process, the wafers are made into laser diodes. Then, the laser diode, filter, metal lid and other components are packaged into a TO can (Transmitter Outline can), and then the TO can be packaged with a ceramic sleeve and the like into an optical sub-module (OSA). Finally, with the electronic sub-module (ESA), the electronic sub-module includes two transmitting and receiving driver ICs for driving the laser diode and the photo-detecting diode, and the optical sub-modules are combined to form an optical transmission module.
The optical submodule can be further subdivided into a Transmitter Optical Subassembly (TOSA) and a Receiver Optical Subassembly (ROSA).
The main performance indicators of TOSA include optical power (Po) and center wavelength (λc). Optical power commonly used units mW (or uW), such as Po = 0.5mW; unit of central wavelength nm, common wavelengths such as λc = 850nm, λc = 1310nm, λc = 1490nm, λc = 1550nm and so on.